Industry: Chemicals and Materials
Published Date: December-2024
Format: PPT*, PDF, EXCEL
Delivery Timelines: Contact Sales
Number of Pages: 192
Report ID: PMRREP19009
The electrodeposited copper foils market is estimated to increase from US$ 10.7 Bn in 2025 to US$ 20.1 Bn by 2032. The market is projected to record a CAGR of 9.5% during the forecast period from 2025 to 2032.
The electrodeposited copper foils market is experiencing significant growth, driven by the expanding electronics industry, the rise of electric vehicles (EVs), and advancements in renewable energy technologies. The increasing shift toward electric vehicles has significantly boosted the demand for electrodeposited copper foils.
The growing trend toward the miniaturization of electronic devices and the development of flexible electronics has led to an increased demand for thinner and more flexible electrodeposited copper foils. These are crucial for manufacturing compact and flexible PCBs.
Key Highlights of the Market
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Market Attributes |
Key Insights |
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Electrodeposited Copper Foils Market Size (2025E) |
US$ 10.7 Bn |
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Projected Market Value (2032F) |
US$ 20.1 Bn |
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Global Market Growth Rate (CAGR 2025 to 2032) |
9.5% |
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Historical Market Growth Rate (CAGR 2019 to 2023) |
6.4% |
Asia Pacific dominates the global electrodeposited copper foils market with a 46% share, primarily due to its robust electronics manufacturing sector and the rapid adoption of electric vehicles (EVs).
Countries like China, Japan, and South Korea are home to leading electronics manufacturers, driving substantial demand for electrodeposited copper foils used in printed circuit boards (PCBs) and other electronic components. China, in particular, has emerged as a global leader in EV production, manufacturing 8 million electric vehicles in 2023 alone, which boosts the demand for copper foils in lithium-ion batteries.
Supportive policies promoting renewable energy and electric mobility further stimulate market growth in the region. Asia Pacific electrodeposited copper foils market is projected to expand at a CAGR of approximately 11.7% from 2025 to 2032. The growth is attributed to the pivotal role in the global electrodeposited copper foils market, driven by technological advancements and increasing demand across various industries.
Based on thickness, the market is divided into <20 µm, 20-50 µm, and > 50 µm. Out of these, the <20 µm dominates with 44% of the total market share. The prominence of the <20 µm thickness segment is primarily attributed to the ongoing trend of miniaturization in electronic devices.
As consumer electronics become compact and lightweight, there is an increasing demand for thinner copper foils that can accommodate intricate circuit designs without compromising performance. Such ultra-thin foils are essential in manufacturing high-density printed circuit boards (PCBs) used in smartphones, tablets, and wearable devices.
The rise of flexible electronics has further propelled the demand for <20 µm copper foils. Its superior flexibility and conductivity make them ideal for applications in flexible displays and foldable gadgets, where traditional thicker foils would be unsuitable.
The growth is expected to be driven by continuous advancements in electronic device manufacturing and the expanding adoption of electric vehicles, which require lightweight and efficient components.
Based on application, the market classified into printed circuit boards, Emi shielding, batteries, and switchgear. Among these, the printed circuit boards dominate the market, with a 78% share.
PCBs are fundamental to virtually all electronic devices, which connect and support electronic components. The superior electrical conductivity of electrodeposited copper foils enhances the performance and reliability of PCBs, making them indispensable in the electronics industry.
Excellent thermal conductivity of copper improves heat dissipation across PCBs, reducing stress from uneven heating and minimizing the risk of failure. The proliferation of consumer electronics, such as smartphones, laptops, and wearable devices, has significantly increased the demand for high-quality PCBs. This surge directly boosts the requirement for electrodeposited copper foils.
The trend toward miniaturization and the development of flexible electronics necessitates thinner and more reliable copper foils, further driving electrodeposited copper foils market growth.
Electrodeposited copper foils are slender layers of copper generated via an electroplating technique. Electroplating entails metal deposition onto a substrate by applying an electric current.
Electrodeposited copper foils utilize this technology to produce a consistent and thin copper coating on a conductive substrate. These foils are used in a variety of goods, including lithium-ion batteries, high-power batteries for hybrid and electric vehicles, rigid printed circuit boards, and flexible printed circuit boards.
The need for printed circuit boards is rising, which is driving the market development in consumer electronics items such as computers, mobile phones, TVs, telecommunications equipment, laptops, and circuit boards. As the substrate for electrical connections and components, PCBs are fundamental in electronic devices.
The electrodeposited copper foils market held a CAGR of 6.4% during the period from 2019 to 2023, driven by the increasing demand for printed circuit boards (PCBs) in consumer electronics.
The proliferation of smartphones, laptops, and other electronic devices fueled the need for thinner, and high-performance copper foils. The early adoption of electric vehicles (EVs) contributed significantly to the market as copper foils are essential in lithium-ion batteries.
The market is poised for accelerated growth post-2025, with a projected CAGR of around 9.5% through 2032. The market growth is estimated to be driven by the rapid expansion of the EV sector, supported by global initiatives to reduce carbon emissions and promote clean energy.
Flexible and miniaturized electronic device advancements is projected to further boost demand for ultra-thin copper foils. Key players increasingly invest in capacity expansion and research and development to cater to emerging applications, such as renewable energy systems and advanced PCBs.
Supportive government policies, particularly in regions like Europe and North America, are expected to diversify the geographical demand distribution, ensuring sustainable market growth.
Increasing Demand for Hybrid and Electric Vehicles to Boost the Sales
The electric vehicle industry is a significant end-use sector for electrodeposited copper foil. The batteries that power these electric vehicles use electrodeposited copper foil. Similarly, it is anticipated that the market for hybrid vehicles is likely to expand at a CAGR of 20.2% over the same time frame.
Since 2019, the number of electric vehicles on the road has increased, with battery electric vehicle adoption somewhat outpacing plug-in hybrid electric vehicle adoption. Almost eighty percent of the world's electric vehicles are found in China, the United States, the Netherlands, Norway, and Japan.
The growth of the global electrodeposited copper foil market is anticipated to be driven by the anticipated substantial expansion in the market for electric and hybrid vehicles during the forecast period.
Increased Demand for Electrodeposited Copper Foils in the Production of PCBs
Steady expansion and innovation in the electronics sector, propelled by technological advancements and the emergence of new electronic gadgets, support the demand for PCBs. It subsequently drives the market value of electrodeposited copper foils.
PCBs are utilized beyond conventional consumer electronics, finding applications in automotive, healthcare, aerospace, and other sectors. The diversity of applications is anticipated to influence market growth further in the coming years.
Continuous advancements in production techniques, exemplified by the Modified Semi-Additive Process (MSAP), are perpetually driving the optimization of electrodeposited copper foils. These satisfy the changing demands of PCB producers, thus improving their market competitiveness.
Price Volatility of Raw Materials Remains a Key Barrier
The electrodeposited copper foils market is significantly influenced by fluctuations in copper prices, which is a primary raw material. Copper prices are subject to various factors, including geopolitical tensions, mining disruptions, and changes in global demand. Such volatility can increase production costs, reduce manufacturers' profit margins, and create competitive pricing challenges.
For small and medium-sized enterprises, the inability to absorb or hedge against these fluctuations often limits their capacity to invest in advanced manufacturing technologies or expand production capabilities. End users such as electronics and EV manufacturers may hesitate to lock in long-term contracts, fearing cost escalations. This restraint affects the market growth by introducing unpredictability in supply chain management and cost planning.
Increasing Adoption of Ultra-Thin Copper Foils for Flexible Electronics
The rising demand for flexible and compact electronic devices has sparked a significant trend in the electrodeposited copper foils market. Modern consumer electronics, such as foldable smartphones, wearable devices, and compact tablets, require thinner and more adaptable components to support high-density circuit designs.
Ultra-thin copper foils, typically less than 10 micrometres in thickness, provide superior electrical conductivity and flexibility, making them ideal for such applications. The miniaturization trend in the electronics industry further accelerates the demand for these foils.
Flexible printed circuit boards (FPCBs) utilizing ultra-thin foils enable innovative designs and enhanced durability, paving the way for advancements in IoT devices and portable medical equipment. The trend is further bolstered by ongoing research and development investments by major players to improve the performance of ultra-thin foils, ensuring their adoption in a broader range of applications.
The competitive landscape of the electrodeposited copper foils market is characterized by the presence of established players and emerging companies focusing on innovation and capacity expansion. Key players like Circuit Foil Luxembourg, JX Nippon Mining & Metals, SK Nexilis, and Denkai America dominate the market due to their strong research and development capabilities and extensive production facilities.
Companies like Volta Energy Solutions and Lotte Energy Materials are investing notably in new production plants to cater to the rising demand for electric vehicles and flexible electronics. Strategic partnerships, mergers, and regional expansions are common strategies in the market followed by the market players. Advancements in ultra-thin and high-performance copper foils enable companies to cater to the miniaturization trend in electronics, further intensifying market competition.
Recent Industry Developments in the Electrodeposited Copper Foils Market
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Attributes |
Details |
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Forecast Period |
2025 to 2032 |
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Historical Data Available for |
2019 to 2024 |
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Market Analysis |
US$ Billion for Value |
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Key Regions Covered |
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Key Market Segments Covered |
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Key Companies Profiled in the Report |
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Report Coverage |
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Customization & Pricing |
Available upon request |
By Thickness
By Application
By Region
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Electrodeposited copper foil is manufactured through the deposition of copper coils onto the cathode drum through electrolysis.
Copper foil is used for electromagnetic shielding in various electronic devices.
Metals, Metal Alloys, Semiconductors, Metal Oxides, Nanomaterials can be electrodeposited.
It is based on the reduction or deposition of active materials on the electrode surface.
Mitsui Mining & Smelting Co., Ltd, JX Nippon Mining & Metals Corporation, Jiangxi Copper Corporation, are some of the key players.
